Aligner, apparatus and method for transferring wafer, microdevice and method formanufacturing the same
A Standard patent application filed on 29 March 2001 credited to Aoki, Takashi ; Owa, Soichi ; Shiraishi, Naomasa

Details

Application number :
44620  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Aligner, apparatus and method for transferring wafer, microdevice and method formanufacturing the same  
Inventor :
Aoki, Takashi ; Owa, Soichi ; Shiraishi, Naomasa  
Agent name :
 
Address for service :
 
Filing date :
29 March 2001  
Associated companies :
 
Applicant name :
Nikon Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor