Laminate with inside layer circuit used for multilayer printed circuit board forhigh frequency circuit, and method and device for measuring circuit impedance o f the laminate with inside layer circuit
A Standard patent application filed on 28 March 2001 credited to Nakashiba, Toru
;
Matsushita, Yukio
;
Iwaishi, Tatsumi
;
Kurata, Kanji
;
Nagaso, Mitsuhide
;
Akamatsu, Motoyuki
;
Yoshimitsu, Tokio
;
Takedomi, Masanobu
Details
Application number :
44589
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Laminate with inside layer circuit used for multilayer printed circuit board forhigh frequency circuit, and method and device for measuring circuit impedance o f the laminate with inside layer circuit