Method for embedding an ic component into a foamed layer of a chip card
A Standard patent application filed on 22 November 1999 credited to Hoppe, Joachim ; Zapf, Rudolf ; Strassmaier, Josef ; Hohmann, Arno

Details

Application number :

16527  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method for embedding an ic component into a foamed layer of a chip card  

Inventor :

Hoppe, Joachim ; Zapf, Rudolf ; Strassmaier, Josef ; Hohmann, Arno  

Agent name :

 

Address for service :

 

Filing date :

22 November 1999  

Associated companies :

 

Applicant name :

Giesecke & Devrient GmbH  

Applicant address :

 

Old name :

 

Original Source :

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