Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method
A Standard patent application filed on 01 October 1998 credited to Lenihan, Timothy G. ; Schaper, Leonard W ; Brown, William D ; Malshe, Ajay P

Details

Application number :

10648  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method  

Inventor :

Lenihan, Timothy G. ; Schaper, Leonard W ; Brown, William D ; Malshe, Ajay P  

Agent name :

 

Address for service :

 

Filing date :

01 October 1998  

Associated companies :

 

Applicant name :

Board of Trustees of the University of Arkansas, The  

Applicant address :

 

Old name :

 

Original Source :

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