Bumped substrate assembly
A Standard patent application filed on 13 October 1998 credited to Balents, Leon M ; Zsamboky, Kalman F ; Morrison, James S. ; Christopher, Kenneth W.

Details

Application number :

96944  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Bumped substrate assembly  

Inventor :

Balents, Leon M ; Zsamboky, Kalman F ; Morrison, James S. ; Christopher, Kenneth W.  

Agent name :

 

Address for service :

 

Filing date :

13 October 1998  

Associated companies :

 

Applicant name :

Zecal Incorporated  

Applicant address :

 

Old name :

 

Original Source :

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