Three-dimensional packaging configuration for multi-chip module assembly
A Standard patent application filed on 01 October 1998 credited to Hawke, Robert E. ; Patel, Atin J. ; Fletcher, Thomas G. ; Divita, Charles ; McNeil, Lynn ; Binapal, Sukhminder S.

Details

Application number :

94253  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Three-dimensional packaging configuration for multi-chip module assembly  

Inventor :

Hawke, Robert E. ; Patel, Atin J. ; Fletcher, Thomas G. ; Divita, Charles ; McNeil, Lynn ; Binapal, Sukhminder S.  

Agent name :

 

Address for service :

 

Filing date :

01 October 1998  

Associated companies :

 

Applicant name :

Gennum Corporation  

Applicant address :

 

Old name :

 

Original Source :

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