In situ plasma wafer bonding method
A Standard patent application filed on 28 August 1998 credited to Roberds, Brian E. ; Farrens, Sharon N.

Details

Application number :

92960  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

In situ plasma wafer bonding method  

Inventor :

Roberds, Brian E. ; Farrens, Sharon N.  

Agent name :

 

Address for service :

 

Filing date :

28 August 1998  

Associated companies :

 

Applicant name :

Farrens, Sharon N.  

Applicant address :

 

Old name :

 

Original Source :

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