Process chamber and method for depositing and/or removing material on a substrate
A Standard patent application filed on 03 August 1998 credited to Chiu, Ting H. ; Holtkamp, William H. ; Cho, Peter ; Lowery, Kenneth J ; Ko, Wen C.

Details

Application number :

86864  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Process chamber and method for depositing and/or removing material on a substrate  

Inventor :

Chiu, Ting H. ; Holtkamp, William H. ; Cho, Peter ; Lowery, Kenneth J ; Ko, Wen C.  

Agent name :

 

Address for service :

 

Filing date :

03 August 1998  

Associated companies :

 

Applicant name :

Cutek Research, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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