Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die
A Standard patent application filed on 15 July 1998 credited to Livengood, Richard H.

Details

Application number :

84065  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die  

Inventor :

Livengood, Richard H.  

Agent name :

 

Address for service :

 

Filing date :

15 July 1998  

Associated companies :

 

Applicant name :

Intel Corporation  

Applicant address :

 

Old name :

 

Original Source :

Go  

Same Inventor

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