IC module, iC card, sealing resin for IC module, and method for manufacturing I C module
A Standard patent application filed on 16 July 1998 credited to Shimada, Naoki ; Fukushima, Yoshikazu ; Gogami, Masao ; Ozaki, Katsuyoshi

Details

Application number :

82429  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

IC module, iC card, sealing resin for IC module, and method for manufacturing I C module  

Inventor :

Shimada, Naoki ; Fukushima, Yoshikazu ; Gogami, Masao ; Ozaki, Katsuyoshi  

Agent name :

WATERMARK PATENT AND TRADE MARKS ATTORNEYS  

Address for service :

Level 2 302 Burwood Road HAWTHORN VIC 3122  

Filing date :

16 July 1998  

Associated companies :

 

Applicant name :

Dainippon Printing Co. Ltd.  

Applicant address :

 

Old name :

 

Original Source :

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