Method of forming a chip scale package, and a tool used in forming the chip scale package
A Standard patent application filed on 07 May 1998 credited to Von Seggern, Walter ; Razon, Eli

Details

Application number :

72948  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of forming a chip scale package, and a tool used in forming the chip scale package  

Inventor :

Von Seggern, Walter ; Razon, Eli  

Agent name :

 

Address for service :

 

Filing date :

07 May 1998  

Associated companies :

 

Applicant name :

Kulicke & Soffa Industries, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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