Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used therefor
A Standard patent application filed on 12 June 1998 credited to Ichinose, Michihiko

Details

Application number :

71840  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used therefor  

Inventor :

Ichinose, Michihiko  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

12 June 1998  

Associated companies :

 

Applicant name :

NEC Electronics Corporation  

Applicant address :

1753 Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa 211-8668, Japan  

Old name :

NEC Corporation  

Original Source :

Go