Ball grid array package assembly including stand-offs
A Standard patent application filed on 09 April 1998 credited to Chia, Chok J. ; Mccormick, John P. ; Alagaratnam, Maniam ; Variot, Patrick

Details

Application number :

69633  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Ball grid array package assembly including stand-offs  

Inventor :

Chia, Chok J. ; Mccormick, John P. ; Alagaratnam, Maniam ; Variot, Patrick  

Agent name :

 

Address for service :

 

Filing date :

09 April 1998  

Associated companies :

 

Applicant name :

LSI Logic Corporation  

Applicant address :

 

Old name :

 

Original Source :

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