Plastic-Encapsulated Semiconductor Device and Fabrication Method Thereof
A Standard patent application filed on 17 April 1998 credited to Ichikawa, Seiji ; Umemoto, Takeshi ; Nishibe, Toshiaki ; Sato, Kazunari ; Tubota, Kunihiko ; Tahara, Kazuhiro ; Nishimura, Yoshikazu ; Okahira, Keita ; Miya, Tatsuta ; Kitakoga, Tooru ; Suga, Masato

Details

Application number :

61965  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Plastic-Encapsulated Semiconductor Device and Fabrication Method Thereof  

Inventor :

Ichikawa, Seiji ; Umemoto, Takeshi ; Nishibe, Toshiaki ; Sato, Kazunari ; Tubota, Kunihiko ; Tahara, Kazuhiro ; Nishimura, Yoshikazu ; Okahira, Keita ; Miya, Tatsuta ; Kitakoga, Tooru ; Suga, Masato  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

17 April 1998  

Associated companies :

 

Applicant name :

NEC Electronics Corporation  

Applicant address :

1753 Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa 211-8668, Japan  

Old name :

NEC Compound Semiconductor Devices, Ltd. ; NEC Corporation  

Original Source :

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