Adhesive resin compositions and laminates using the compositions for adhesive layers
A Standard patent application filed on 21 January 1998 credited to Morizono, Kenichi ; Kawachi, Hideshi ; Shigemoto, Hiromi ; Okada, Keiji

Details

Application number :

56778  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Adhesive resin compositions and laminates using the compositions for adhesive layers  

Inventor :

Morizono, Kenichi ; Kawachi, Hideshi ; Shigemoto, Hiromi ; Okada, Keiji  

Agent name :

Davies Collison Cave  

Address for service :

Level 15 1 Nicholson Street MELBOURNE VIC 3000  

Filing date :

21 January 1998  

Associated companies :

 

Applicant name :

Mitsui Chemicals, Inc.  

Applicant address :

2-5, Kasumigaseki 3-chome, Chiyoda-ku Tokyo 100 Japan  

Old name :

 

Original Source :

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