Method and apparatus for full width ultrasonic bonding

Application number :: 54577
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Method and apparatus for full width ultrasonic bonding
Inventor :: Brennecke, Craig Steven ; Samida, Jeffrey Joseph ; Klemp, Paul Gordon ; Cottingham, Jeffery Ray
Agent name :: SPRUSON & FERGUSON
Address for service :: GPO Box 3898 SYDNEY NSW 2001
Filing date :: 25 November 1997
Associated companies :
Applicant name :: Kimberly-Clark Worldwide, Inc.
Applicant address :: 401 North Lake Street Neenah WI 54956 United States of America
Old name :
Original Source :: Go

Method and apparatus for full width ultrasonic bonding A Standard patent application filed on 25 November 1997 credited to Brennecke, Craig Steven ; Samida, Jeffrey Joseph ; Klemp, Paul Gordon ; Cottingham, Jeffery Ray