Details

Application number :
51363  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment  
Inventor :
Hashimoto, Nobuaki  
Agent name :
 
Address for service :
 
Filing date :
04 December 1997  
Associated companies :
 
Applicant name :
Seiko Epson Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor