Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them
A Standard patent application filed on 29 October 1997 credited to Yusa, Masami ; Ichimura, Shigeki ; Inoue, Fumio ; Kato, Toshihiko

Details

Application number :

47251  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them  

Inventor :

Yusa, Masami ; Ichimura, Shigeki ; Inoue, Fumio ; Kato, Toshihiko  

Agent name :

 

Address for service :

 

Filing date :

29 October 1997  

Associated companies :

 

Applicant name :

Hitachi Chemical Company, Ltd.  

Applicant address :

 

Old name :

 

Original Source :

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