Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
A Standard patent application filed on 08 October 1997 credited to Yamamoto, Kazunori ; Shimada, Yasushi ; Kumashiro, Yasushi ; Inada, Teiichi ; Kuriya, Hiroyuki ; Kageyama, Akira ; Tomiyama, Takeo ; Nomura, Yoshihiro ; Hosokawa, Yoichi ; Kirihara, Hiroshi ; Kaneda, Aizou

Details

Application number :

44717  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film  

Inventor :

Yamamoto, Kazunori ; Shimada, Yasushi ; Kumashiro, Yasushi ; Inada, Teiichi ; Kuriya, Hiroyuki ; Kageyama, Akira ; Tomiyama, Takeo ; Nomura, Yoshihiro ; Hosokawa, Yoichi ; Kirihara, Hiroshi ; Kaneda, Aizou  

Agent name :

 

Address for service :

 

Filing date :

08 October 1997  

Associated companies :

 

Applicant name :

Hitachi Chemical Company, Ltd.  

Applicant address :

 

Old name :

 

Original Source :

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