Improved thickness monitoring
A Standard patent application filed on 11 August 1997 credited to Holbrook, Mark Burton
;
Wilkinson, Christopher David Wicks
;
Hicks, Simon Eric
;
Beckmann, William George
Details
Application number :
38568
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Improved thickness monitoring
Inventor :
Holbrook, Mark Burton
;
Wilkinson, Christopher David Wicks
;
Hicks, Simon Eric
;
Beckmann, William George