Resin composition and flexible printed circuit board
A Standard patent application filed on 29 November 2000 credited to Kawaguchi, Akiyoshi
;
Tanaka, Tomohiro
;
Tsutsumi, Hideyuki
;
Ishii, Yoshiaki
Details
Application number :
16487
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Resin composition and flexible printed circuit board