Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
A Standard patent application filed on 27 June 1997 credited to Kubly, Marc B. ; Germain, Steven D. ; Benjamin, Neil Martin Paul

Details

Application number :

35851  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system  

Inventor :

Kubly, Marc B. ; Germain, Steven D. ; Benjamin, Neil Martin Paul  

Agent name :

 

Address for service :

 

Filing date :

27 June 1997  

Associated companies :

 

Applicant name :

Lam Research Corporation  

Applicant address :

 

Old name :

 

Original Source :

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