Film-like adhesive for connecting circuit and circuit board
A Standard patent application filed on 15 July 1997 credited to Watanabe, Itsuo ; Takemura, Kenzo ; Watanabe, Osamu ; Yamamoto, Kazunori ; Nagai, Akira ; Kojima, Kazuyoshi ; Tanaka, Toshiaki ; Shiozawa, Naoyuki

Details

Application number :

34609  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Film-like adhesive for connecting circuit and circuit board  

Inventor :

Watanabe, Itsuo ; Takemura, Kenzo ; Watanabe, Osamu ; Yamamoto, Kazunori ; Nagai, Akira ; Kojima, Kazuyoshi ; Tanaka, Toshiaki ; Shiozawa, Naoyuki  

Agent name :

 

Address for service :

 

Filing date :

15 July 1997  

Associated companies :

 

Applicant name :

Hitachi Chemical Company, Ltd.  

Applicant address :

 

Old name :

 

Original Source :

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