Physical vapor deposition targets, conductive integrated circuit metal alloy interconnections, electroplating anodes, and metal alloys for use as a conductive interconnection in an integrated circuit
A Standard patent application filed on 14 November 2000 credited to Nagano, Shozo ; Buehler, Jane ; Li, Jianxing ; Hargarter, Hinrich

Details

Application number :

16095  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Physical vapor deposition targets, conductive integrated circuit metal alloy interconnections, electroplating anodes, and metal alloys for use as a conductive interconnection in an integrated circuit  

Inventor :

Nagano, Shozo ; Buehler, Jane ; Li, Jianxing ; Hargarter, Hinrich  

Agent name :

 

Address for service :

 

Filing date :

14 November 2000  

Associated companies :

 

Applicant name :

Honeywell International, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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