Process for the non-galvanic tin plating of copper or copper alloys
A Standard patent application filed on 09 November 2000 credited to Bell, Jane ; Heyer, Joachim ; Kleinfeld, Marlies ; Kalker, Ingo ; Hupe, Jurgen

Details

Application number :

15975  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Process for the non-galvanic tin plating of copper or copper alloys  

Inventor :

Bell, Jane ; Heyer, Joachim ; Kleinfeld, Marlies ; Kalker, Ingo ; Hupe, Jurgen  

Agent name :

 

Address for service :

 

Filing date :

09 November 2000  

Associated companies :

 

Applicant name :

Enthone, Incorporated  

Applicant address :

 

Old name :

 

Original Source :

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