Details

Application number :
31370  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Low temperature material bonding technique  
Inventor :
Ramsey, J. Michael ; Wabg, Hongying ; Foote, Robert S.  
Agent name :
 
Address for service :
 
Filing date :
15 May 1997  
Associated companies :
 
Applicant name :
Lockheed Martin Energy Systems, Inc.  
Applicant address :
 
Old name :
 
Original Source :
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