Low temperature material bonding technique
A Standard patent application filed on 15 May 1997 credited to Ramsey, J. Michael ; Wabg, Hongying ; Foote, Robert S.

Details

Application number :

31370  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Low temperature material bonding technique  

Inventor :

Ramsey, J. Michael ; Wabg, Hongying ; Foote, Robert S.  

Agent name :

 

Address for service :

 

Filing date :

15 May 1997  

Associated companies :

 

Applicant name :

Lockheed Martin Energy Systems, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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