Microencapsulatable solvent adhesive composition and method for coupling conduits
A Standard patent application filed on 15 May 1997 credited to Roesch, Mark A. ; Maccarone, David A. ; Lynch, Roland M. ; Newsom, Morris F. ; Hillenbrand, Gary F.

Details

Application number :

31328  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Microencapsulatable solvent adhesive composition and method for coupling conduits  

Inventor :

Roesch, Mark A. ; Maccarone, David A. ; Lynch, Roland M. ; Newsom, Morris F. ; Hillenbrand, Gary F.  

Agent name :

 

Address for service :

 

Filing date :

15 May 1997  

Associated companies :

 

Applicant name :

Lamson + Sessions Co., The  

Applicant address :

 

Old name :

 

Original Source :

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