Binders for cores and molds
A Standard patent application filed on 23 May 1997 credited to Johnson, Calvin K.
;
Algar, Brian E.
;
Zaretskiy, Leonid S.
;
Tse, Kwok-Tuen
Details
Application number :
30742
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Binders for cores and molds
Inventor :
Johnson, Calvin K.
;
Algar, Brian E.
;
Zaretskiy, Leonid S.
;
Tse, Kwok-Tuen
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
23 May 1997
Associated companies :
Applicant name :
Borden Chemical, Inc.
Applicant address :
180 East Broad Street Columbus Ohio 43215 United States Of America