Tab tape ball grid array package with vias laterally offset from solder ball bond sites
A Standard patent application filed on 02 April 1997 credited to Schueller, Randolph D. ; Evans, Howard E. ; Plepys, Anthony R ; Geissinger, John D.

Details

Application number :

24354  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Tab tape ball grid array package with vias laterally offset from solder ball bond sites  

Inventor :

Schueller, Randolph D. ; Evans, Howard E. ; Plepys, Anthony R ; Geissinger, John D.  

Agent name :

 

Address for service :

 

Filing date :

02 April 1997  

Associated companies :

 

Applicant name :

Minnesota Mining and Manufacturing Company  

Applicant address :

 

Old name :

 

Original Source :

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