Organic particulate-filled adhesive
A Standard patent application filed on 27 October 2000 credited to Engel, Michael R.
;
Young, Chung I.
;
Govek, Michael
;
Ruegsegger, Michael L.
;
Stumpf, Michael R.
;
Tseng, Chi-Ming
;
Delmore, Michael D
Details
Application number :
14400
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Organic particulate-filled adhesive
Inventor :
Engel, Michael R.
;
Young, Chung I.
;
Govek, Michael
;
Ruegsegger, Michael L.
;
Stumpf, Michael R.
;
Tseng, Chi-Ming
;
Delmore, Michael D