Cerium oxide abrasive, semiconductor chip, semiconductor device, process for the production of them, and method for the polishing of substrates
A Standard patent application filed on 07 February 1997 credited to Matsuzawa, Jun
;
Honma, Yoshio
;
Tanno, Kiyohito
;
Kurata, Yasushi
Details
Application number :
16705
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Cerium oxide abrasive, semiconductor chip, semiconductor device, process for the production of them, and method for the polishing of substrates