Multilayer electronic assembly utilizing a sinterable composition and related method of forming
A Standard patent application filed on 24 February 1997 credited to Ernsberger, Craig N ; Leach, Sarah E ; Meyer, Richard C ; Wenzel, Ralph J ; Allen, Kathleen E

Details

Application number :

14878  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Multilayer electronic assembly utilizing a sinterable composition and related method of forming  

Inventor :

Ernsberger, Craig N ; Leach, Sarah E ; Meyer, Richard C ; Wenzel, Ralph J ; Allen, Kathleen E  

Agent name :

FB Rice  

Address for service :

Level 23 44 Market Street SYDNEY NSW 2000  

Filing date :

24 February 1997  

Associated companies :

 

Applicant name :

CTS Corporation  

Applicant address :

905 West Boulevard North Elkhart Indiana 46514 United States Of America  

Old name :

 

Original Source :

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