Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board
A Standard patent application filed on 04 February 1997 credited to Busse, Ralf-Dieter ; Lade, Thomas ; Storbeck, Carsten

Details

Application number :

12513  

Application type :

Standard  

Application status :

SEALED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board  

Inventor :

Busse, Ralf-Dieter ; Lade, Thomas ; Storbeck, Carsten  

Agent name :

Davies Collison Cave  

Address for service :

Level 15 1 Nicholson Street MELBOURNE VIC 3000  

Filing date :

04 February 1997  

Associated companies :

 

Applicant name :

ADC GmbH  

Applicant address :

Beeskowdamm 3-11, 14167 Berlin Germany  

Old name :

Krone Aktiengesellschaft ; Krone GmbH  

Original Source :

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