High speed diamond-based machining of silicon semiconductor die in wafer and packaged form for backside emission microscope detection
A Standard patent application filed on 14 November 1996 credited to Hurley, Daniel T.

Details

Application number :
77312  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
High speed diamond-based machining of silicon semiconductor die in wafer and packaged form for backside emission microscope detection  
Inventor :
Hurley, Daniel T.  
Agent name :
 
Address for service :
 
Filing date :
14 November 1996  
Associated companies :
 
Applicant name :
Hypervision, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor