Details

Application number :
11779  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Heat transfer apparatus using refrigerant and computer having the same  
Inventor :
Lee, Kwang-Soon ; Lee, Mok-Hyoung  
Agent name :
 
Address for service :
 
Filing date :
08 November 2000  
Associated companies :
 
Applicant name :
Lee, Mok-Hyoung  
Applicant address :
 
Old name :
 
Original Source :
Go  

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