Semiconductor unit package, semiconductor unit packaging method and encapsulant for use in semiconductor unit packaging
A Standard patent application filed on 12 June 1996 credited to Omoya, Kazunori ; Oobayashi, Takashi ; Bessho, Yoshihiro ; Harada, Mitsuru ; Sakurai, Wataru

Details

Application number :

60154  

Application type :

Standard  

Application status :

SEALED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor unit package, semiconductor unit packaging method and encapsulant for use in semiconductor unit packaging  

Inventor :

Omoya, Kazunori ; Oobayashi, Takashi ; Bessho, Yoshihiro ; Harada, Mitsuru ; Sakurai, Wataru  

Agent name :

FB Rice  

Address for service :

Level 23 44 Market Street SYDNEY NSW 2000  

Filing date :

12 June 1996  

Associated companies :

 

Applicant name :

Matsushita Electric Industrial Co., Ltd.  

Applicant address :

1006 Oaza Kadoma Kadoma-shi Osaka 571 Japan  

Old name :

 

Original Source :

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