Floor plan for scalable multiple level interconnect architec ture
A Standard patent application filed on 30 April 1996 credited to Pani, Peter M.
;
Ting, Benjamin S
Details
Application number :
58515
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Floor plan for scalable multiple level interconnect architec ture