Improved method and apparatus for chemical mechanical polish ing
A Standard patent application filed on 17 May 1996 credited to Hoshizaki, Jon A.
;
Williams, Roger O.
;
Buhler, James D.
;
Lee, Lawrence L.
;
Hollywood, William K.
;
De Geus, Richard
;
Reichel, Charles A.
Details
Application number :
57963
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Improved method and apparatus for chemical mechanical polish ing
Inventor :
Hoshizaki, Jon A.
;
Williams, Roger O.
;
Buhler, James D.
;
Lee, Lawrence L.
;
Hollywood, William K.
;
De Geus, Richard
;
Reichel, Charles A.