Thermal insulating supporting device for piping
A Standard patent application filed on 13 June 1996 credited to Okada, Akira ; Hama, Satoshi ; Nakamura, Toshikazu ; Morohashi, Mamoru

Details

Application number :
55961  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Thermal insulating supporting device for piping  
Inventor :
Okada, Akira ; Hama, Satoshi ; Nakamura, Toshikazu ; Morohashi, Mamoru  
Agent name :
Shelston IP  
Address for service :
Level 21 60 Margaret Street SYDNEY NSW 2000  
Filing date :
13 June 1996  
Associated companies :
 
Applicant name :
JGC Corporation  
Applicant address :
2-2-1 Ohtemachi Chiyoda-ku Tokyo United States Of America  
Old name :
 
Original Source :
Go  

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