Details
- Application number :
- 51244
- Application type :
- Standard
- Application status :
- CEASED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Apparatus for heating a mold for an injection molding system
- Inventor :
- Byon, Sung Kwang
- Agent name :
- Madderns
- Address for service :
- GPO Box 2752 ADELAIDE SA 5001
- Filing date :
- 22 March 1996
- Associated companies :
-
- Applicant name :
- Daewoo Electronics Co., Ltd.
- Applicant address :
- 541 5-ga Namdaemoon-ro Jung-ku Seoul Republic Of Korea
- Old name :
-
- Original Source :
- Go