Hermetically sealed microwave integrated circuit package with ground plane fused to package frame
A Standard patent application filed on 12 October 1995 credited to McKleroy, Christopher C

Details

Application number :

42817  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Hermetically sealed microwave integrated circuit package with ground plane fused to package frame  

Inventor :

McKleroy, Christopher C  

Agent name :

 

Address for service :

 

Filing date :

12 October 1995  

Associated companies :

 

Applicant name :

Litton Systems, Incorporated  

Applicant address :

 

Old name :

 

Original Source :

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