Details
- Application number :
- 79874
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Advanced flip-chip join package
- Inventor :
- Ishida, Kenzo
;
Kubota, Jiro
;
Takahashi, Kenji
- Agent name :
-
- Address for service :
-
- Filing date :
- 27 September 2000
- Associated companies :
-
- Applicant name :
- Intel Corporation
- Applicant address :
-
- Old name :
-
- Original Source :
- Go