Details

Application number :
38346  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Saw blade segment with silver solder  
Inventor :
Kim, Jae Woo ; Han, Jung-Soo  
Agent name :
 
Address for service :
 
Filing date :
02 May 1995  
Associated companies :
 
Applicant name :
Ehwa Diamond Ind. Co., Ltd.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor