Molded parts used for photographic sensitive materials and resin compositions used to make thereof
A Standard patent application filed on 01 August 1995 credited to Shinohara, Ken-Ichi ; Yoneyama, Takashi ; Suzuki, Osamu ; Kassal, Robert J

Details

Application number :

32104  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Molded parts used for photographic sensitive materials and resin compositions used to make thereof  

Inventor :

Shinohara, Ken-Ichi ; Yoneyama, Takashi ; Suzuki, Osamu ; Kassal, Robert J  

Agent name :

 

Address for service :

 

Filing date :

01 August 1995  

Associated companies :

 

Applicant name :

E.I. Du Pont De Nemours and Company  

Applicant address :

 

Old name :

 

Original Source :

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