Curable epoxy resin composition which gives flexible cured aticle
A Standard patent application filed on 04 August 1995 credited to Hioki, Akira
;
Kawamura, Tetsuhi
;
Morio, Kazuhiko
Details
Application number :
31908
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Curable epoxy resin composition which gives flexible cured aticle