Polyamide composition for molding
A Standard patent application filed on 22 October 1999 credited to Hayashi, Ryuichi ; Koshida, Reiko ; Tanaka, Tamoo ; Ishizuka, Shigeo ; Une, Narumi

Details

Application number :
14496  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Polyamide composition for molding  
Inventor :
Hayashi, Ryuichi ; Koshida, Reiko ; Tanaka, Tamoo ; Ishizuka, Shigeo ; Une, Narumi  
Agent name :
Callinans  
Address for service :
PO Box 1189 HARTWELL VIC 3124  
Filing date :
22 October 1999  
Associated companies :
 
Applicant name :
E.I. Du Pont De Nemours and Company  
Applicant address :
1007 Market Street Wilmington DE 19898 United States Of America  
Old name :
 
Original Source :
Go  

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