Method and means for improving bonding between polymer materials, in particular for chip card
A Standard patent application filed on 04 October 2000 credited to Dossetto, Lucille ; Calvas, Bernard ; Fidalgo, Jean-Christophe ; Elbaz, Didier

Details

Application number :

76723  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and means for improving bonding between polymer materials, in particular for chip card  

Inventor :

Dossetto, Lucille ; Calvas, Bernard ; Fidalgo, Jean-Christophe ; Elbaz, Didier  

Agent name :

 

Address for service :

 

Filing date :

04 October 2000  

Associated companies :

 

Applicant name :

Gemplus  

Applicant address :

 

Old name :

 

Original Source :

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