Metallurgically bonded polymer vias
A Standard patent application filed on 18 November 1994 credited to Leach, Sarah E ; Allen, Kathy ; Ernsberger, Craig N ; Meyer, Richard C ; Wenzel, Ralph J

Details

Application number :

11822  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Metallurgically bonded polymer vias  

Inventor :

Leach, Sarah E ; Allen, Kathy ; Ernsberger, Craig N ; Meyer, Richard C ; Wenzel, Ralph J  

Agent name :

 

Address for service :

 

Filing date :

18 November 1994  

Associated companies :

 

Applicant name :

CTS Corporation  

Applicant address :

 

Old name :

 

Original Source :

Go