Process and apparatus for in situ electroplating a structural layer of metal bonded to an internal wall of a metal tube
A Standard patent application filed on 15 November 1994 credited to Palumbo, Gino
;
Brennenstuhl, Alexander M
;
Gonzalez, Francisco
;
Lichtenberger, Philip C
Details
Application number :
81372
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Process and apparatus for in situ electroplating a structural layer of metal bonded to an internal wall of a metal tube
Inventor :
Palumbo, Gino
;
Brennenstuhl, Alexander M
;
Gonzalez, Francisco
;
Lichtenberger, Philip C