Low cost 3d flip-chip packaging technology for integrated power electronics modules
A Standard patent application filed on 20 September 2000 credited to Lu, Guo-Quan ; Liu, Xingsheng

Details

Application number :

75933  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Low cost 3d flip-chip packaging technology for integrated power electronics modules  

Inventor :

Lu, Guo-Quan ; Liu, Xingsheng  

Agent name :

 

Address for service :

 

Filing date :

20 September 2000  

Associated companies :

 

Applicant name :

Virginia Tech Intellectual Properties, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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